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          MSDS 
             Technique 
             Data 0027  Bonding 
          of Some Self-etch Adhesives to Unground Enamel 
 F.R. TAY1, D.H. PASHLEY2, N.M. KING1, J. TSAI1, C.N.S. LAI1, R.M. CARVALHO3, 
          and L. MARQUEZINI, Jr.3, 1 The University of Hong Kong, China, 2 Medical 
          College of Georgia, Augusta, USA, 3 University of São Paulo, 
          Bauru, Brazil
 Objectives: Manufacturers of mild self-etch adhesives such as 
          Clearfil SE Bond (SE: Kuraray) recommend adjunctive phosphoric acid-etching 
          when bonding to unground enamel. Some of the recently introduced self-etch 
          adhesives are more acidic in nature and are claimed to bond well to 
          both enamel and dentin. This study examined the ultrastructure and microtensile 
          bond strengths (mTBS) of two of these more aggressive versions, Xeno 
          III (XE: Dentsply), a 1-step self-etch adhesive, and Simplicity (JK: 
          Apex Dental Materials), a 2-step self-etch adhesive to unground enamel. 
          SE was used as the negative control, and One-Step (OS: Bisco), a total-etch 
          adhesive bonded to 32% phosphoric acid-etched unground enamel was used 
          as the positive control. Methods: The adhesives were applied 
          to unground enamel on the mesial and distal surfaces of extracted human 
          molars, coupled with light-cured composites, and then thermocycled between 
          5-55°C for 1000X. For TEM, bonded specimens were sectioned without 
          resin-embedding, producing separation of the enamel hybrid layer from 
          the underlying unbonded enamel by a stiffness-toughness mismatch. For 
          bond testing, composite-enamel beams (N=24) were sectioned and tested 
          with a universal testing machine at a crosshead speed of 1 mm/min.
 Results: Enamel hybrid layer thickness (mm): OS (9.6±1.3)A, 
          JK (3.3± 0.5)A,B, XE (1.0±0.2)B,C, SE (0.3±0.1)C 
          [P<0.05]. Dissolution of enamel crystallites on the surface of enamel 
          hybrid layers varied from being barely dissolved (SE) to superficial 
          dissolution (XE; JK) to internal dissolution with central hole regions 
          (JK; OS). mTBS results showed that OS, JK and XE were not significantly 
          different from each other, but were all significantly higher than SE 
          [P<0.001]. There was no correlation between hybrid layer thickness 
          and mTBS. Conclusion: The more aggressive self-etch adhesives exhibit 
          similar bond strength as a total-etch adhesive to unground enamel, making 
          them potentially useful as pit-and-fissure sealants and bonding of orthodontic 
          brackets.
        
          
           
                                                                                                                                                                                                                                                          
  
 
   
          
  
 
                                                     
   
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